Avizo是一个三维分析软件的科学和工业的数据。无论三维成像数据集需要处理,材料科学,地球科学和工程应用,Avizo提供了一个直观的工作流程和易于使用的图形状态的最先进的丰富的图像数据处理,探索和分析功能的用户界面。
材料科学
Avizo是探索和理解材料的结构和性能,在很宽范围的材料科学的研究领域和许多类型的材料,一种先进的三维分析软件应用程序(多孔介质,金属和合金,纤维材料,复合材料,...)
数码岩分析
Avizo是探索和表征岩芯样品和数码摇滚数据集先进的3D可视化和分析软件的应用。它提供了一个全面的软件平台上运行先进的数字常规或特殊的核心或核心分析
电子
Avizo软件提供了用于可视化和由断层摄影术,显微术,磁共振成像,并且多种技术分析半导体材料数据的有力工具。从故障/缺陷的检测和分析,性能和过程性评价和材料特性。
工业检测
从故障/缺陷的检测和分析,自动在线或单一零件检测,性能和过程性评价,及材料定性,Avizo是用在整个的材料或产品的所有研究,设计和开发阶段,在很宽的范围内领域 - 航空,航天,汽车,电子,建筑和制造业。
FEI Avizo v8.1.1 (x86 / x64) | 857 MB / 978 MB
Avizo is a 3D analysis software for scientific and industrial data. Wherever three-dimensional imaging data sets need to be processed, in materials science, geosciences or engineering applications, Avizo offers abundant state-of-the-art image data processing, exploration and analysis features within an intuitive workflow and easy-to-use graphical user interface.
Materials Sciences
Avizo is an advanced 3D analysis software application for exploring and understanding materials structures and properties, in a wide range of materials science research areas and for many types of materials (porous media, metals and alloys, fibrous materials, composites, …)
Digital Rock Analysis
Avizo is an advanced 3D visualization and analysis software application for exploring and characterizing core samples and digital rock data sets. It offers a comprehensive software platform to run advanced digital routine or special core or core analysis
Electronics
Avizo software provides powerful tools for visualizing and analyzing semiconductor materials data from tomography, microscopy, MRI, and more techniques. From defect/flaw detection and analysis, to performance and process evaluation, and materials characterization.
Industrial Inspection
From defect/flaw detection and analysis, automated in-line or single-part inspection, to performance and process evaluation, and materials characterization, Avizo is used in throughout all the research, design and development phases of materials or products, across a wide range of fields – in aviation and aerospace, automotive, electronics, construction, and manufacturing.
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发布日期: 2014-10-21