DYNAFORM软件是美国ETA公司和LSTC公司联合开发的用于板料成形数值模拟的专用软件，是LS-DYNA求解器与ETA/FEMB前后处理器的完美结合，是当今流行的板料成形与模具设计的CAE工具之一。

Dynaform 软件基于有限元方法建立, 被用于模拟钣金成形工艺。

Dynaform软件包含BSE、DFE、Formability三个大模块，几乎涵盖冲压模模面设计的所有要素，包括：定最佳冲压方向、坯料的设计、工艺补充面的设计、拉延筋的设计、凸凹模圆角设计、冲压速度的设置、压边力的设计、摩擦系数、切边线的求解、压力机吨位等。

Dynaform软件可应用于不同的领域，汽车、航空航天、家电、厨房卫生等行业。

可以预测成形过程中板料的裂纹、起皱、减薄、划痕、回弹、成形刚度、表面质量，评估板料的成形性能，从而为板成形工艺及模具设计提供帮助。

Dynaform软件设置过程与实际生产过程一致，操作上手容易。

来设计可以对冲压生产的全过程进行模拟：坯料在重力作用下的变形、压边圈闭合过程、拉延过程、切边回弹、回弹补偿、翻边、胀形、液压成形、弯管成形。

Dynaform软件适用的设备有：单动压力机、双动压力机、无压边压力机、螺旋压力机、锻锤、组合模具和特种锻压设备等。

DynaForm 5.9 | 545.4 mbEngineering Technology Associates, Inc.

(ETA) announced the release of DYNAFORM Version 5.

9.

In the new version, a brand new module, incorporating optimization, has been unveiled.

The Optimization Platform (OP) makes DYNAFORM the most complete and powerful solution on the market for die system simulation and optimization.

ETA has embedded Red Cedar’s proprietary optimization technology, SHERPA, into the OP module.

The module is focused on supporting optimization of drawbead forces along with binder pressure, lubrication, gage, and material.

Using the newest optimization technology, the OP module reduces product development time and cost for manufacturing by reducing incidents of wrinkling, thinning and tearing with limited effort.

The OP guided user interface makes optimization viable for a larger set of users, since special optimization expertise is not required.

Additionally, the latest computing platforms combined with an efficient solver eliminate demanding computing requirements.

The solver is an incremental solution (INCSolver) that delivers exceptional speed, taking advantage of Shared Memory Processing (SMP) computing technology on multiple core machines running Windows 7 and beyond.

The OP module will use the same common interface as the other four modules of DYNAFORM that include Blank Size Engineering (BSE), Die Face Engineering (DFE), Formability Simulation (FS), and Die System Analysis (DSA).

Each of the four previously available modules has also been enhanced in the Version 5.

9 software release.

Complete DYNAFORM Version 5.9 Release Notes, are now available online atAbout Engineering Technology Associates, Inc.

Engineering Technology Associates, Inc.

(ETA) was established in 1983 by advanced product development engineers working as structural analysts for the world’s largest automotive manufacturers.

ETA’s expertise in the areas of vehicle durability, NVH, metal forming, crashworthiness, occupant safety and product design have provided an intimate knowledge of the challenges and needs of the product development engineer.

Proactive in the creation and implementation of new analysis methods and software, ETA is the developer of the Inventium Suite, an enterprise product development solution that includes DYNAFORM.

Name:DynaformVersion:5.xHome:Interface:englishOS:Windows XP / Vista / SevenSize:545.4 mb